China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier
China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier China Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding) - China Supplier

Second-hand 16B double-sided polishing machine processing accuracy: ≤0.001mm (suitable for ultra-thin wafer high-precision grinding)

Price:元12500 /吨
Industry Category: Machinery
Product Category:
Brand: CMT
Spec: 16B-5P


Contact Info
  • Add:东莞市茶山镇增卢路186号5号楼101室, Zip: 523380
  • Contact: 杨肖梅
  • Tel:0769-23105805
  • Email:2531943211@qq.com

Other Products

Description
Additional Information

Detailed Introduction:

I. Equipment Parameters and Core Functions Basic Parameters Model: CMT CGD-16B (used imported model) Processing Accuracy: ≤0.001mm (suitable for ultra-thin sheet high-precision grinding)

Sales Technical Manager Yang: 18103045976

Applicable Materials: Silicon wafers, alumina, ceramics, metals, quartz glass, and other hard and brittle materials Control Method: Touch screen + PLC control, supports automated operation Equipment Dimensions: Approximately 1800×1550×2850mm (excluding electrical/pneumatic boxes) Core Functions Four-Motor Independent Control: Independent drive for upper plate, lower plate, center gear, and outer ring gear, supports forward and reverse processing modes Grinding Powder Circulation System: Adjustable processing and cleaning modes, enhancing process flexibility Automated Design: Integrated sensor switches and safety control systems, reducing operational risks

II. Typical Application Scenarios Semiconductor Industry: Double-sided polishing of silicon wafers, surface treatment of chip substrates Optical Device Manufacturing: Precision grinding of optical components such as glass code discs and quartz glass Automotive Parts Processing: Ultra-flat processing of metal/ceramic materials like brake discs and sensor substrates Experimental R&D: Small and medium-sized enterprises for new product trial production or small-batch manufacturing

III. Market Supply and Pricing Characteristics Supply Channels Enterprise Transfers: Second-hand equipment provided by companies like Dongguan Zhunna Optoelectronics and Hongcheng Optical Products Equipment Condition: Primarily 90% new equipment, some with technical parameters and operation manuals Release Date: Latest supply information as of March 2025 (e.g., inventory equipment in Dongguan Chashan) Cost-Effectiveness Advantages Second-hand equipment prices are approximately 30%-50% of new machines, suitable for small and medium-sized enterprises with limited budgets Controllable maintenance costs, parts can be sourced from original manufacturers or third-party channels

IV. Key Considerations for Selection Equipment Condition Verification: Focus on checking spindle accuracy, pneumatic systems, and PLC program stability Parts Completeness: Confirm the integrity of core components such as worm gearboxes and cylinders After-Sales Service: Prioritize suppliers offering debugging support or warranty services


Industry Category Machinery
Product Category
Brand: CMT
Spec: 16B-5P
Stock: 16
Manufacturer:
Origin: China / Guangdong / Dongshi
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